Numerical simulation of transient liquid phase bonding under temperature gradient

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dc.contributor.authorGhobadi Bigvand, Arian
dc.contributor.examiningcommitteeElMekkawy, Tarek (Mechanical and Manufacturing Engineering) Rajapakse, Athula (Electrical and Computer Engineering)en_US
dc.contributor.supervisorOjo, Olanrewaju Akanbi (Mechanical and Manufacturing Engineering)en_US
dc.date.accessioned2013-07-30T19:49:16Z
dc.date.available2013-07-30T19:49:16Z
dc.date.issued2013-07-30
dc.degree.disciplineMechanical and Manufacturing Engineeringen_US
dc.degree.levelMaster of Science (M.Sc.)en_US
dc.description.abstractTransient Liquid Phase bonding under Temperature Gradient (TG-TLP bonding) is a relatively new process of TLP diffusion bonding family for joining difficult-to-weld aerospace materials. Earlier studies have suggested that in contrast to the conventional TLP bonding process, liquid state diffusion drives joint solidification in TG-TLP bonding process. In the present work, a mass conservative numerical model that considers asymmetry in joint solidification is developed using finite element method to properly study the TG-TLP bonding process. The numerical results, which are experimentally verified, show that unlike what has been previously reported, solid state diffusion plays a major role in controlling the solidification behavior during TG-TLP bonding process. The newly developed model provides a vital tool for further elucidation of the TG-TLP bonding process.en_US
dc.description.noteOctober 2013en_US
dc.identifier.urihttp://hdl.handle.net/1993/21969
dc.language.isoengen_US
dc.rightsopen accessen_US
dc.subjectBondingen_US
dc.subjectSimulationen_US
dc.subjectFinite element methoden_US
dc.subjectTLPen_US
dc.subjectTG-TLPen_US
dc.titleNumerical simulation of transient liquid phase bonding under temperature gradienten_US
dc.typemaster thesisen_US
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