Numerical simulation of transient liquid phase bonding under temperature gradient

Loading...
Thumbnail Image
Date
2013-07-30
Authors
Ghobadi Bigvand, Arian
Journal Title
Journal ISSN
Volume Title
Publisher
Abstract
Transient Liquid Phase bonding under Temperature Gradient (TG-TLP bonding) is a relatively new process of TLP diffusion bonding family for joining difficult-to-weld aerospace materials. Earlier studies have suggested that in contrast to the conventional TLP bonding process, liquid state diffusion drives joint solidification in TG-TLP bonding process. In the present work, a mass conservative numerical model that considers asymmetry in joint solidification is developed using finite element method to properly study the TG-TLP bonding process. The numerical results, which are experimentally verified, show that unlike what has been previously reported, solid state diffusion plays a major role in controlling the solidification behavior during TG-TLP bonding process. The newly developed model provides a vital tool for further elucidation of the TG-TLP bonding process.
Description
Keywords
Bonding, Simulation, Finite element method, TLP, TG-TLP
Citation