Transient liquid phase bonding of dissimilar single crystal superalloys
Loading...
Date
2016
Authors
Olatunji, Oluwadamilola
Journal Title
Journal ISSN
Volume Title
Publisher
Abstract
Transient liquid phase (TLP) bonding has proven to be the preferred method for joining extremely difficult-to-weld advanced materials, including similar and dissimilar superalloys. In this work, an approach that combines experiments and theoretical simulations are used to investigate the effect of temperature gradient (TG) in a vacuum furnace on the temperature distribution in TLP bonded samples. When joining similar materials by this technique, the simulated results with experimental verifications show that, irrespective of where the samples are placed inside the vacuum furnace, a TG in the furnace can translate into a symmetric temperature distribution in bonded samples provided the diffusion direction is parallel to the source of heat emission. In addition, the effects of TLP bonding parameters on the joint microstructure were investigated during the joining of nickel-based IN738 and CMSX-4 single crystal (SX) superalloys. An increase in holding time and reduction in gap size reduces the width of eutectic product that forms within the joint region. It was also found that Liquid-state diffusion (LSD) can occur and have significant effects on the microstructure of dissimilar TLP bonded joints even though its influence is often ignored during TLP bonding. The occurrence of LSD produced single crystal joint when a SX and polycrystal substrate were bonded. This formation of a SX joint which cannot be exclusively produced by solid-state diffusion has not been previously reported in the literature.
Description
Keywords
Dissimilar Nickel-based Supperalloys, Transient Liquid Phase Bonding, 3-D Simulation, Liquid state diffusion, Solid state diffusion