Design and implementation of a thermal hardware-in-the-loop (THIL) platform for evaluating physical cooling systems in real-time simulation

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dc.contributor.authorFang, Yin
dc.contributor.examiningcommitteeZhou, Jenny (Electrical and Computer Engineering)en_US
dc.contributor.examiningcommitteeZhu, Guozhen (Mechanical Engineering)en_US
dc.contributor.supervisorHo, Carl
dc.date.accessioned2023-01-06T22:21:20Z
dc.date.available2023-01-06T22:21:20Z
dc.date.copyright2022-12-27
dc.date.issued2022-12-27
dc.date.submitted2022-12-28T01:40:31Zen_US
dc.degree.disciplineElectrical and Computer Engineeringen_US
dc.degree.levelMaster of Science (M.Sc.)en_US
dc.description.abstractPower electronics (PE) take a critical role in electricity transformation, transmission and application in modern industrial utilization. Improving the efficiency while maintaining the stability of performance of electrical system and device is a continuously studied topic. In high power PE applications, hundreds and thousands of watts of heat is generated in conduction and switching status, as a result of that, design of cooling system is essential in a PE system design process. This thesis proposed a real-time Thermal Hardware-In-the-Loop (THIL) simulation methodology to evaluate performance of cooling system of power semiconductors in a power circuit. This method required less energy and cost rather than traditional completely physical test as well as providing credible result of semiconductor junction temperature and instantaneous power dissipation.en_US
dc.description.noteFebruary 2023en_US
dc.identifier.urihttp://hdl.handle.net/1993/37070
dc.language.isoengen_US
dc.rightsopen accessen_US
dc.subjectHardware-in-the-Loopen_US
dc.subjectcooling system performanceen_US
dc.subjectsemiconductor lossen_US
dc.titleDesign and implementation of a thermal hardware-in-the-loop (THIL) platform for evaluating physical cooling systems in real-time simulationen_US
dc.typemaster thesisen_US
local.subject.manitobanoen_US
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