The effects of bonding parameters on isothermal solidification rate and microstructure of TLP bonded in 738LC superalloy

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dc.contributor.authorIdowu, Oluwaseun Ayodejien_US
dc.date.accessioned2013-05-07T19:11:10Z
dc.date.available2013-05-07T19:11:10Z
dc.date.issued2005en_US
dc.degree.disciplineMechanical and Manufacturing Engineeringen_US
dc.degree.levelMaster of Science (M.Sc.)en_US
dc.description.abstracten_US
dc.format.extentx, 129 leaves :en_US
dc.identifier(Sirsi) a1553565en_US
dc.identifier.urihttp://hdl.handle.net/1993/20158
dc.language.isoengen_US
dc.rightsopen accessen_US
dc.titleThe effects of bonding parameters on isothermal solidification rate and microstructure of TLP bonded in 738LC superalloyen_US
dc.typemaster thesisen_US
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