Show simple item record

dc.contributor.supervisorOliver, Derek (Electrical and Computer Engineering)en_US
dc.contributor.authorshenouda, mina
dc.date.accessioned2014-09-17T20:03:09Z
dc.date.available2014-09-17T20:03:09Z
dc.date.issued2014-09-17
dc.identifier.urihttp://hdl.handle.net/1993/24050
dc.description.abstractThe dielectric properties of polymeric thin films (100-200 nm) are hard to measure with the standard approaches as the samples aren't free standing necessitating a supporting substrate. Consequently, a planar interdigitated sample holder has been designed to hold the thin film where the polymeric capacitance was derived from the passing fringing fields. The electrodes were fabricated by creating 120 nm trenches in a SiO2/Si wafer; 20 nm Cr was deposited as an adhesion layer prior to the deposition of Cu by thermal evaporation. The electrical measurements were implemented using HP 4294A and a probe station. Devices of 20 to 70 fingers were measured and the results were compared to the analytical and finite element simulation. At 10 KHz, the total measured capacitance of a 20-finger device was about 8 pF with 3 % represented the polymeric contribution. The measurements differed from the calculations or finite modeling results by about 12%.en_US
dc.language.isoengen_US
dc.rightsinfo:eu-repo/semantics/openAccess
dc.subjectthinen_US
dc.subjectfilmsen_US
dc.subjectdielectricen_US
dc.subjectinterdigitateden_US
dc.subjectspectroscopyen_US
dc.subjectelectrodesen_US
dc.titleFabrication of planar interdigitated electrodes for dielectric spectroscopy of thin filmsen_US
dc.typeinfo:eu-repo/semantics/masterThesis
dc.typemaster thesisen_US
dc.degree.disciplineElectrical and Computer Engineeringen_US
dc.contributor.examiningcommitteeKordi, Behzad (Electrical and Computer Engineering) Xing, Malcolm (Mechanical Engineering)en_US
dc.degree.levelMaster of Science (M.Sc.)en_US
dc.description.noteFebruary 2015en_US


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record