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dc.contributor.author Chung, Daniel Y. en_US
dc.date.accessioned 2013-03-07T20:31:19Z
dc.date.available 2013-03-07T20:31:19Z
dc.date.issued 1993 en_US
dc.identifier ocm00018170 en_US
dc.identifier.uri http://hdl.handle.net/1993/17519
dc.description.abstract en_US
dc.format.extent viii [i.e. ix], 115 leaves : en_US
dc.language en_US
dc.rights en_US
dc.rights info:eu-repo/semantics/openAccess
dc.title Analyses of the annealing processes and the effects of plasma treated substrate surfaces for MOS devices en_US
dc.type info:eu-repo/semantics/masterThesis
dc.type master thesis en_US
dc.degree.discipline Electrical and Computer Engineering en_US


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